Join us in San Diego for InterPACK 2023

Microsanj is pleased to announce our sponsorship for InterPACK 2023, to be held on October 24-26 in San Diego, CA. We recognize this conference as an important venue for discussing and exchanging information on electronics packaging and 3D heterogeneous integration. Microsanj recognizes the increasing challenges posed by these advanced packaging techniques driven by 3DHI circuits.

The technology developed for the analysis of individual chips does not scale to the analysis and characterization of full 3DHI microsystems, where faults and defects may be buried within a complex stack of disparate chips and materials. Microsanj wants the world to know that in recognition of these challenges, our engineering staff is pursuing further development of our leading thermal imaging solutions with the introduction of several new advances, including optical pump probing, ultrafast transient analysis, and over-the-air imaging.

Microsanj will also be proactively involved with the NIST CHIPS R&D Standards initiative as well as DARPA programs designed to address thermal limitations in high-power devices, known as THREADS,  and the DARPA initiative to identify new approaches for failure analysis of 3DHI circuits.

For more information on these activities, please drop by Table 2 while you are at InterPACK® and speak with one of our personnel.

We look forward to seeing you in San Diego!

To register or view the schedule, visit the event website: https://event.asme.org/InterPACK