Check out the full presentation at EPTC 2023 in Singapore by Mo Shakouri, President & CEO of Microsanj, and Sidina Wane, Founder & CEO of eV Technologies!

Whether driven by the need for portability or the need to integrate more functionality into a small form factor, demands for miniaturization are leading to higher levels of integration. Designs including antenna-in-package, for applications at 20 GHz and above and Antenna-on-Chip, for applications in the 100 GHz range are typical of this trend. These advanced performance-driven designs create further challenges for packaging, testing, and most importantly, thermal management. This presentation describes a holistic Near-Field (NF) Over-The-Air (OTA) testing approach for Chip-Package-PCB-Antenna modules based on advanced thermal imaging techniques and a novel Thin-Film coating using Spin-Crossover (SCO) materials.