Value-Added Benefits Of Submicron Thermal Imaging With Ultrafast Transient Response

Thermal Characterization & Thermal Profiling

Key Benefits
  • 2D and 3D imaging
  • Spatial resolution to 290 nm
  • Time resolution to <800 ps
  • Temperature resolution to 0.1 °C
  • Ensure long-term device reliability with optimal performance
Application & Tech Note(s)

TN-003 Characterizing Non-Uniform Temperature & Current Distributions in SCR for ESD Protection

TN-004 Thermal Characterization of High Power In-Line MOSFET Transistor Arrays

Time-Dependent Thermal Analysis

Key Benefits
  • Characterize high speed logic circuits & analyze other time-dependent thermal effects
  • Nano-sec to pico-sec transient analysis for ultrafast switching devices & circuits
Application & Tech Note(s)

AN-006 Analysis of Time-Dependent Thermal Events in High Speed Logic Integrated Circuits

Flip Chip Thermal Analysis

Key Benefits
  • In SITU thru-the-substrate imaging
  • Heat sinking integrity
  • Pin-point thermal sources by observing thermal time delay
  • Link emission & thermal images
Application & Tech Note(s)

AN-007 Through-the-Substrate Imaging Enables Flip-Chip Thermal Analysis

Hot Spot Detection & Failure Analysis

Key Benefits

Locate, Analyze, & Fix:

  • Short circuits
  • Oxide defects
  • Junction defects
  • High resistance vias
  • Processing defects, etc.
Application & Tech Note(s)

AN-005 Detecting Hot-Spots and Other Thermal Defects on a Sub-Micron Scale in Electronic and Optoelectronic Devices

TN-002 Locating Defects in GaAs & GaN Sub-Micron High Electron Mobility Transistors (HEMTs)

Other Application Notes

AN-002: Preparing Device Samples for Thermal Analysis and Thermal Mapping Using the Thermoreflectance Imaging Analyzer

AN-003: Understanding the Thermoreflectance Coefficient: The Key to Achieving Optimal Temperature & Spatial Resolution for Thermal Imaging of Microelectronic Devices

For more information: Product Catalog, Product Reference Guide

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