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    Flip chip mounting is a method for interconnecting a semiconductor device or integrated circuit to its surrounding circuitry by means of solder bumps that are added to the topside of the device when the wafer is processed. The device is connected to the external circuitry by flipping it upside down and aligning the solder bumps on the device with the appropriate connecting pads on the substrate or circuit board. This interconnection technique is an alternative to mounting the device right side up and using wire-bonding techniques to connect the device pads to the external circuitry. The flip chip mounting approach virtually eliminates the parasitic inductance common with wire-bonding and it requires less space on the substrate on which it is mounted.

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