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    • Updated: January 22, 2016
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    Thermal performance is an especially important design consideration in the design of high power devices and components. Excessive heating on any portion of the power device can have an adverse effect on device performance and long-term reliability. The analysis and understanding of the thermal characteristics is increasingly more challenging with shrinking dimensions and more complex topologies prevalent in present day power devices. This Tech Note illustrates the capabilities of transient thermoreflectance thermal imaging in meeting these challenges.