June 2-7, 2019: IMS-2019
The 2019 International Microwave Symposium will be held in conjunction with ARFTG and RFIC in Boston, MA. The Microsanj technical staff will be at Booth 246, stop by to discuss your requirements for precision thermal analysis. Also plan to attend our MicroApps Presentation. For more information about IMS-2019 see: https://ims2019.org/



Dec 4-7, 2018: EPTC-2018
The 20th Electronics Packaging Technology Conference was held at Resorts World Sentosa, Singapore.
Dr. Andrew A. O. Tay was a key note speaker. The title of his presentation is: “Thermal and Failure Analysis of Advanced Sub-Micron Devices Using Transient Thermoreflectance Thermography”. For more information about this conference see: http://www.eptc-ieee.net

Nov 28-30, 2018: IMaRC
The IEEE MTT-S International Microwave and RF Conference was held at the Hotel Novatel in KolKata, INDIA. Microsanj was exhibiting and made a presentation at this conference. For more information see: https://imarc-ieee.org/

Oct 28-Nov 1, 2018: ISTFA-2018
The International Symposium for Testing and Failure Analysis was held in Phoenix, Arizona at the Phoenix Convention Center. Microsanj was at Booth 231. For more information see: https://www.asminternational.org/web/istfa-2018/home

Oct 10-11, 2018: NANO.IL.2018
The NANO.IL.2018 Conference and Exhibition took place at the International Convention Center, Jerusalem, ISRAEL. For more information about NANO.IL see: http://nanoilconf.com/

Sept 23-25, 2018: EuMW
European Microwave Week took place in, Madrid, SPAIN (further details pending)
For more information about EuMW-2018 see: http://www.eumweek.com/

June 10-15, 2018: IMS-2018
The 2018 International Microwave Symposium was held in conjunction with ARFTG and RFIC at the Pennsylvania Convention Center, Philadelphia, PA. The Microsanj technical staff will be at Booth 1728, stop by to discuss your requirements for precision thermal analysis. Also plan to attend our MicroApps Presentation. For more information about IMS-2018 see: https://ims2018.org/ The paper, a joint effort with Raytheon Corp, Analog Devices, Georgia Institute of Technology, and Purdue University, entitled, “UV Thermal Imaging of RF GaN Devices with GaN Resistor Validation” will be presented at ARFTG Friday, June 15th. For more information about ARFTG see: https://arftg.org/

May 29-June 1, 2018: I-THERM 2018
was held at the Sheraton Hotel, San Diego, California. The paper “Optical Pump-Probe Thermoreflectance Imaging for Anisotropic Heat Diffusion” was presented in Session E-3, Wed, May 30 at 1 PM. For more information see: http://www.ieee-itherm.net/itherm/conference/home

May 13-17, 2018 ISPSD
The 30th IEEE International Symposium on Power Semiconductor Devices and ICs was held at the  Palmer House Hilton Hotel in Chicago, USA. The paper entitled, “Observation of Current Filaments in IGBTs with Thermoreflectance Microscopy” was presented. For more information on this conference see: http://ispsd2018.com/

March 19-23, 2018: SEMI-THERM-2018
SEMI-THERM will be held at the Double Tree Hotel in San Jose, CA. The paper “Submicron Local and Time-dependent Thermal Resistance Characterization of GaN HEMTs” will be presented. This paper, for the first time, presents a compact model that clearly and accurately predicts the transient temperature behavior in a GaN transistor. For more information about this conference see: http://semi-therm.org/

March 21-22, 2018, RF and Microwave Trade Show
The trade show of Radiofrequencies, Microwaves, Wireless, EMC and Optical Fiber will take place at the Paris Expo, Paris, FRANCE. AMCAD, http://www.amcad-engineering.com a Microsanj partner, will be participating at this event. For more information this trade show see: http://www.microwave-rf.com/?lang=EN

Nov 13-16, 2017: APMC2017
2017 IEEE Asia Pacific Microwave Conference
 will be held at the Renaissance Hotel, Kuala Lumpur, MALAYSIA. Dr. Andrew Tay will presenting a 2-hour tutorial entitled “Calculation and Measurement of MMIC Junction Temperatures”.  Monday 13 Nov at 13:40.

The tutorial will cover the following:
Thermal characterization of high power microwave devices is important for determining their reliability. Exceeding the optimal temperature will have a detrimental effect on the performance and reliability of these devices. In this tutorial, a recently-developed accurate closed form analytical solution for predicting the junction temperature of a power amplifier Field Effect Transistors (FETs) and a Monolithic Microwave Integrated Circuits (MMICs) will be presented. Its derivation is based on Green’s function integral method on a point heat source developed through method of images. Unlike previous works, the exact location of heat dissipation region is easily taken into account. In addition, present work is easy to implement and reduces the computation time significantly due to absence of double infinite series. This work is also applicable for multiple heat sources by superposition techniques and has been shown to agree well with both the Finite Element Analysis (FEA) and the experimental results. Therefore, this work is useful in quickly and easily predicting the junction temperatures of MMIC devices during the early design stages before a final more accurate thermal analysis of the final design using FEA. Various experimental techniques which are being used to measure temperature of MMIC devices will be reviewed in this tutorial. The two most popular, non-contacting techniques Infrared Thermography (IRT) and Thermoreflectance Thermal Imaging (TTI) will be described in detail. The pros and cons of TRT and TTI will be discussed. The above-mentioned new analytical method has only been recently developed and presented at international conferences and journals. The experimental Thermoreflectance Thermal Imaging technique has only been recently commercialized, making it very user friendly. Hence, it is now time for the microwave community to be updated on them.

For more information on this conference see: http://www.apmc2017.org , technical program information can be found at: http://edas.info/p23178

Nov 5-9, 2017: ISTFA 2017
will be held at the Pasadena Convention Center, Pasadena, CA USA. Microsanj will be at  Booth 420, drop by to discuss your thermal analysis requirements. For more information on this conference see: http://www.asminternational.org/web/istfa-2017

Oct 22-25, 2017: CSICS 2017
The 2017 IEEE Compound Semiconductor Symposium will be held at the Miami Marriott Biscayne Bay
1633 N. Bayshore Drive in Miami, FL USA. Microsanj will be exhibiting. See us at Booth 107 to discuss your thermal analysis requirements. We will also be presenting the paper, “Innovative Submicron Thermal Characterization Method for AlGaN/GaN Power HEMTs with Hyperspectral Thermoreflectance Imaging” on Tuesday, Oct 24th. For more information on this conference see: https://csics.org/ 

Oct 8-13, 2017: EuMW2017
European Microwave Week 2017 will be held in Nuremberg, GERMANY at the Nurnberg Convention Center. bsw TestSystems & Consulting AG will be exhibiting at Stand 152. Drop by to learn more about thermal imaging based on the thremoreflectance principle and how this technology can help you with your thermal challenges. For more information about European Microwave Week see:  http://www.eumweek.com/

Sep 27-29, 2017: THERMINIC 2017
The 23rd International Workshop: Thermal Investigations of ICs and Systems will be held in Amsterdam. The paper, “Thermopower Characterization of InSb Nanowires Using Thermoreflectance” will be presented at this conference.  For more information see:  http://www.therminic2017.eu/

Aug 29-Sep 1, 2017: InterPACK2017
The 2017 InterPACK Conference  was held from August 29 – September 1, 2017 at the Hilton San Francisco Financial District, San Francisco, CA.   Microsanj a Silver Sponsor for this conference. For more information see: https://www.asme.org/events/interpack 

Jun 4-9, 2017: International Microwave Symposium
IMS-2017 was held at the Honolulu Convention Center, Honolulu, HI USA. The IEEE MTT International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as numerous social events and networking opportunities. The symposium also hosts a large commercial exhibition. Co-located with IMS are the IEEE RFIC and ARFTG conferences.

Attending IMS-2017 provides an opportunity to discuss your thermal analysis challenges with Microsanj technical personnel at Booth 1751. Microsanj is also presenting a 2-hour workshop, entitled, Analyzing the Thermal Behavior of Advanced Microwave Devices & ICs. The workshop will be held at Room-318A from 10AM to 12PM on Tuesday, June 6. Workshop attendees will gain a greater appreciation of the importance and benefits of the thermoreflectance thermal imaging technique for achieving optimal device performance while ensuring long-term device reliability.
Additionally, Dr. Ali Shakouri will be a keynote speaker at ARFTG presenting, “Thermal Transport in Transistors Based on GaN and Novel 2D Materials.
For additional information and registration information see: http://ims2017.org/ , http://www.rfic-ieee.org/ , or http://www.arftg.org/

May 30-June 2, 2017, ITHERM ECTC2016: Orlando, FL USA 
ITHERM 2017–will be held at the Walt Disney World Swan & Dolphin Hotel, Lake Buena Vista (Orlando), FL USA. Microsanj has co-authored the paper, “Accurate Thermoreflectance Imaging of Nano-Features Using Thermal Decay”. The paper will be presented: WEDNESDAY, MAY 31ST 8:00 – 9:30 AM SESSION E-1: EMERGING MATERIALS & THERMAL PHENOMENON I. For more information and registration see: http://www.ieee-itherm.org

November 8-9, 2016: ISTFA, 42nd International Symposium for Testing and Failure Analysis, Fort Worth Convention Center Fort Worth, TX USA. We will be exhibiting, please come by to meet with us to learn more about thermal imaging based on thermoreflectance. For more information and registration, see: http://www.asminternational.org/web/istfa-2016  

October 23-26, 2016: CSICS, 2016 IEEE Compound Semiconductor IC Symposium, Austin, Texas, USA. Microsanj will be exhibiting at CSICS-2016. Drop to meet with us at Booth 47.
For more information see: http://www.cvent.com/events/2016-ieee-compound-semiconductor-integrated-circuit-symposium-csics-/event-summary-184c0fe480324caa969ef5077746f024.aspx

October 3-7, 2016: EuMA, European Microwave Association, London, UK Microsanj will participate with our partner AMCAD Engineering at booth 116.  Dustin Kendig will give a talk on Monday, Oct 3rd entitled; “Short Pulse Thermal Response of HBTs”
For more information see: http://www.eumweek.com/conferences/eumic.html

October 2-7, 2016 International Workshop on Nitride Semiconductors (IWN 2016)
Microsanj will be exhibiting at IWN 2016. The conference and exhibit will take place at the Hilton Orlando Lake Buena Vista, 1751 Hotel Plaza Blvd, Lake Buena Vista, FL, USA. For more information see: http://www.mrs.org/iwn-2016/

September 21-23, 2016: THERMINIC 2016, 22nd International Workshop, Thermal Investigations of ICs and Systems, Budapest, Hungary. Dr. Andrew Tay will be presenting the paper “Thermal Analysis of Advanced Microelectronic Devices Using Thermoreflectance Thermography” in Session 6, Thursday, 22 Sept.
For more information see: http://www.therminic2016.eu/

August 16-19, 2016: ICEPT 2016, 17th International Conference on Electronic Packaging Technology, Wuhan, China. On Thursday, 18 August, Dr. Andrew Tay will be presenting, “Thermal Imaging Based on Thermoreflectance Addresses the Challenges for Thermal Analysis of Today’s Advanced Complex Devices”.
For more information see: http://www.icept.org/en/

May 31-June 3, 2016, ITHERM ECTC2016: Las Vegas, Nevada, USA (GOLD SPONSOR / Exhibitor / Presentation)

ITHERM 2016–The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems is at the Cosmopolitan Hotel, Las Vegas, NV, USA (Co-Located with ECTC). Microsanj will present a paper on Wednesday June 1st, 3:55 pm-5:25 pm in Session E2 titled “Thermal Imaging of Nanometer Features”

For more information visit: http://ieee-itherm.org/

May 27, 2016, ARFTG2016: San Francisco, California, USA

87th ARFTG Conference Measurements for Emerging Communications Technologies  – San Francisco, California  at the Mariott Marquis, 780 Mission Street, For more information see: http://arftg.org/index.php/10-future-conferences/31-87th-arftg-conference

May 22-27, 2016 IMS2016: International Microwave Symposium, San Francisco, CA, Exhibitor at Booth 1953 and Presentation

The 2016 IEEE/MTT-S International Microwave Symposium will take place May 24-26, 2016 in San Francisco, CA at the Moscone Center located at 747 Howard St., San Francisco, CA 94103.

IMS2016 will cover developments in microwave technology ranging from nano-devices to system applications. Technical paper sessions, interactive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, and a wide array of other technical activities will be offered at IMS2016.

Dustin Kendig of Microsanj will be presenting the paper, Intrinsic Transient Thermal Response of GaN HEMT” Thursday 13:30 – 13:50 in Session TH3F: Novel and Diverse Measurement Techniques, Location: 308. This IMS-ARFTG session covers a unique set of exciting and contemporary measurement problems. Topics covered include transient thermal analysis, techniques for BIST and production test, and a novel device characterization approach. At the exhibit, you will have the opportunity meet with Microsanj engineers at booth #1953 to learn more about the Microsanj Thermal Imaging Systems. For more information on MTT 2016, visit:  http://www.ims2016.org/

May 18, 2016, IEEE CPMT Technical Talk: “Thermal and Diagnostic Challenges with Today’s Electronic Devices”Speaker: Dustin Kendig, VP Engineering, Microsanj, USA. Organized by: IEEE Singapore Rel/CPMT/ED Chapter and Singapore University of Technology and Design. Time: 10 AM – 11 AM
Venue: Singapore University of Technology and Design, Building 2, Level 4, LT3
Host: Dr. Andrew Tay, andrew_tay@sutd.edu.sg
All are welcome. Registration is not required. For directions see: https://www.google.com.sg/maps/place/Singapore+University+of+Technology+and+Design+(SUTD)/@1.3405005,103.9631207,15z/data=!4m5!3m4!1s0x0:0x7de56b1846994e6c!8m2!3d1.3405005!4d103.9631207

May 16-19, 2016, CS-Mantech: 2016 International Conference on Compound Semiconductor Manufacturing Technology, Hyatt Regency, Miami, FL
Microsanj will be exhibiting, meet with us at Booth 516. On Tuesday evening, May 17th at 6:18 PM, Dr. Mo Shakouri, Microsanj CEO, will present “Nanoscale Thermal Transport Modeling and Characterization”. This presentation will show some of the latest full field transient thermal imaging techniques with submicron spatial and 800 ps time resolution. This capability is used to study temperature non-uniformity in multi finger nanowire gate-allaround MOSFET transistors, in optoelectronic devices, and in high power GaN high electron mobility transistors. For more information see: http://csmantech.org/

March 20-24, 2016, OFC: The Optical Fiber Communication Conference and Exhibition, Anaheim Convention Center, Anaheim, California, USA, Microsanj will be at Booth 2835. On Tuesday, 22 March, Dustin Kendig, VP Engineering, will present;
“Device Level Thermal Characterization for Photonics and Power MMICs” in the Expo Theater III at 12:00 noon.
For more information see: http://www.ofcconference.org/en-us/

March 14-17, 2016 Semi Therm 2016: The 32nd annual conference on thermal design, management and
characterization of electronic components and systems, San Jose, California.  http://www.semi-therm.org/