NT310 Thermal Imaging System
Microsanj Nanotherm Thermal Imaging Systems are based on the thermoreflectance principal, a concept that takes advantage of the relative change in the sample’s surface reflectivity as a function of temperature. As the temperature of the sample changes, the refractive index, and therefore, the reflectivity also changes. The change in reflectivity is dependent on the Thermoreflectance Coefficient, a basic material property that is a function of the illumination wavelength, the sample material and material surface characteristics, and the ambient temperature.
With illumination wavelengths in the visible range, a lock-in technique to enhance signal to noise ratio, and advanced embedded algorithms for data analysis, the Microsanj thermal imaging systems surpass traditional thermal imaging techniques in spatial resolution and temporal resolution.
Shrinking geometries and more complex structures are making it more and more difficult to thermally analyze today’s advanced microelectronic and optoelectronic devices. Further complications arise with die attach techniques designed to minimize parasitic effects and facilitate heat sinking. Non-invasive analysis of flip-chip mounted devices therefore, necessitates the observation of thermally reflected signals through-the-substrate. The NT310B is designed to meet this challenge. The use of near-infrared (NIR) illumination sources and optics optimized for NIR wavelengths enable this functionality. Silicon, a commonly used substrate material, is transparent to wavelengths in the range of 1100 nm. The NT310B is the ideal solution to thermally analyze the static and time-dependent thermal behavior of these types of structures and achieve submicron spatial resolution and 50 nanosecond temporal resolution with 1 ⁰C thermal resolution.
The embedded SanjVIEW310™ software with its advanced algorithms provides a versatile fully integrated platform with a user-friendly interface and a wide range of available formats to facilitate data analysis and presentation. Optional accessories for the NT310B include the Gantry probe station, thermal chuck, and vibration isolation table.
The performance and features of the NT310B High Performance Thru-the-Substrate Image Analyzer makes it the perfect choice for flip-chip thermal imaging and other thermal analysis issues requiring the detection and analysis of multi-layer structures.
The first Microsanj thermal imaging systems based on thermoreflectance were introduced in 2009 and over the ensuing years have gained worldwide acceptance with demonstrated and proven value-added performance in research, development, and manufacturing.
High Performance Thru-the-Substrate Image Analyzer
|System Description||Thru-the-Substrate Transient Thermal Image Analyze|
|Spatial Resolution1 (diffraction limited)||800 nm typical
(dependent on substrate preparation)
|Thermal Resolution1||1 °C typical (5 minute averaging)|
|Active Thermal Pixels||640 x 512|
|Spectral Range||InGaAs 0.9-1.7 μm|
|CCD Interface||Camera Link High Speed Acquisition|
|Image Frame Rate||1.0 Hz|
|Software||SanjVIEWTM 3.0 for control, analysis, & automation|
|Illumination Sources||Near-IR (1050 nm and 1300 nm) LED sources|
|Microscope Objectives||5x, 20x, 100x|
|Biasing||Transient Imaging Module (TIM II) with function generator (5 v, 100 mA)|
|Thermal Imaging Method||Short pulse visible spectrum differential thermoreflectance|
|Transient Resolution||50 ns Typical|
|Probe Station (optional)||18/24 inch Gantry|
|1. Requires optical table mount|