Articles

Most Recent Papers

High-speed thermal imaging can resolve short RF pulse effects in tissue models

Top Papers

Accurate Thermoreflectance Imaging of Nano-Features Using Thermal Decay

Physical Origins of Current and Temperature Controlled Negative Differential Resistances in NbO2

Full-Field Thermal Imaging of Quasiballistic Crosstalk Reduction in Nanoscale Devices

Sub-Diffraction Thermoreflectance Thermal Imaging using Image Reconstruction

ESD Devices

High Speed Thermal Characterization of ESD Protection Devices

Failure Analysis

Ensuring Advanced Semiconductor Device Reliability using FA and Submicron Defect Detection

Imaging Failures in Sub-Micron Devices and Measuring Stresses in 3D ICs

GaN

High Resolution Thermal Characterization and Simulation of Power AlGaN/GaN HEMTs Using Micro-Raman Thermography and 800 Picosecond Transient Thermoreflectance Imaging

UV Thermal Imaging of RF GaN Devices with GaN Resistor Validation

Thermal Modeling and Characterization of a Gallium Arsenide Power Amplifier MMIC

Recent Advances in GaN Power HEMTs Related to Thermal Problems and Low-Cost Approaches

Thermal Transport in Transistors Based on GaN and Novel 2D Materials

Multiphysics measurements of GaN Power Microwave Transistors

Transient Thermal Characterization of AlGaN/GaN HEMTs Under Pulsed Biasing

IGBT’s

Observation of Current Filaments in IGBTs with Thermoreflectance Microscopy

Logic_ICs

Transient Thermal Measurement and Behavior of Integrated Circuits

Nano Features Re-TransientCAL 

Accurate Thermoreflectance Imaging of Nano-Features Using Thermal Decay

Optical Pump Probe

Optical Pump-Probe Thermoreflectance Imaging for Anisotropic Heat Diffusion

Optoelectronics

Transient Thermal Imaging Characterization of a Die Attached Optoelectronic Device on Silicon

RF Microwave

Hyperspectral Thermoreflectance Imaging for AlGaN/GaN Power HEMTs

Thermal Modeling and Characterization of a Gallium Arsenide Power Amplifier MMIC

Analyzing the Thermal Behavior of Advanced Microwave Devices & ICs

Application Notes

Comparing Thermoreflectance with Infrared Imaging for the Thermal Characterization of Electronic and Optoelectronic Devices
AN-001

Preparing Device Samples for Thermal Analysis and Thermal Mapping Using the Thermoreflectance Imaging Analyzer
AN-002

Understanding the Thermoreflectance Coefficient: The Key to Achieving Optimal Temperature & Spatial Resolution for Thermal Imaging of Microelectronic Devices
AN-003

Comparing Thermoreflectance (TTI), Infrared (IR), Near Infrared Emission (EMMI), and Optical Beam Induced Resistance Change (OBIRCH) Imaging Techniques
AN-004

Detecting Hot-Spots and Other Thermal Defects on a Sub-Micron Scale in Electronic and Optoelectronic Devices
AN-005

Analysis of Time-Dependent Thermal Events in High Speed Logic Integrated Circuits
AN-006

Through-the-Substrate Imaging Enables Flip Chip Thermal Analysis
AN-007

Tech Notes

Thermoreflectance Imaging: What is it?
TN-001A

Thermoreflectance Thermal Imaging (TTI) & Infrared Microscopy (IR): A Comparative Overview
TN-001B

Locating Defects in Sub-micron High Electron Mobility Transistors (HEMTs)
TN-002

Characterizing Non-uniform Temperature & Current Distributions in SCR for ESD Protection
TN-003

Thermal Characterization of High-power In-line Transistor Arrays
TN-004